Indium Corporation continues to develop innovative solder paste solutions to fit customers' needs. PicoShot™ NC-5M is designed for customers needing a no-clean halogen-free SAC305 solder paste for their Mycronic jetting systems or add-on and repair modules.
PicoShot™ NC-5M jetting solder paste is the first material to come out of Indium Corporation's new partnership with Mycronic, a global leader in dispensing and jet printing equipment.
PicoShot™ NC-5M is a no-clean halogen-free solder paste approved after joint Indium/Mycronic technical development with Mycronic's MY 600/700 jetting systems. PicoShot™ can be used in standalone applications, such as system-in-package (SiP), jetting into cavities, stencil-replacement, shield attach, and microBGA. It also complements the stencil printing of Indium8.9HF. Designed as a no-clean solder paste, PicoShot™ can be cleaned easily with industry standard cleaning solutions.
PicoShot™ NC-5M's formulation meets or exceeds:
- ANSI/IPC J-STD-004B ROL0 requirements
- Halogen-free requirements per IPC and IEC61249-2-21 standards
- IPC standards for SIR and ECM
Additionally, PicoShot™:
- Provides exceptional jetting performance for a halogen-free Pb-free solder paste
- Reflows in air or nitrogen (ppm O2 level from 50-1,000)
- Has a clear residue with minimal flow-out
- Significantly reduces of head-in-pillow (HIP)
- Eliminates or significantly reduces graping
- Minimizes reflow spatter
Indium Corporation also offers a PicoShot™ NC-5M conditioner (purging gel) designed to allow the rapid purging, cleaning, and long-term storage of jetting, dispense, and microdispense systems without the use of liquid solvents. PicoShot™ Conditioner C-1 is a chemically benign, bright blue-colored translucent, viscous gel that aids in visual endpoint detection and prevents inconsistent dispense volumes and clogging caused by solder paste dry-out.
To learn more about Indium Corporation's new jetting paste, visit https://www.indium.com/products/solders/solder-paste/ – jetting-paste.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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