Indium Corporation’s Brandon Judd, Technical Support Engineer, will present at the Surface Mount Technology Association (SMTA) Rocky Mountain chapter meeting on Jan. 26 at the Mile High Stadium in Denver, Colo.
Judd 将介绍QFN 组装工艺中助焊剂涂层焊料预型件的优点。讨论将包括介绍如何将具有现代助焊剂涂层的焊料预型件与适当的焊膏结合使用，以帮助减少 QFN 下的空洞。他还将分享确保最佳结果的设计和工艺参数。
Judd provides technical support for Indium Corporation’s advanced SMT assembly materials, including solder pastes, thermal interface materials, fluxes, and engineered solders. He specializes in optimizing SMT lines, and has expertise in stencil printing parameters and reflow profiling. In addition to providing technical support, he performs testing on new products in Indium Corporation’s Advanced Materials and Process Development Lab.
贾德拥有纽约州立大学理工学院机械工程技术学士学位。他是 SMTA 认证的工艺工程师，并获得了达特茅斯学院 Thayer 工程学院的六西格玛绿带证书。
SMTA是一个由专业人士组成的国际网络，他们在电子组装技术（包括微系统、新兴技术和相关业务运营）方面培养技能、分享实践经验并开发解决方案。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
