Indium Corporation expert Graham Wilson, Applications Engineer, will share his industry expertise at the 22nd European Microelectronics and Packaging Conference, September 16-19, in Pisa, Italy.
Wilson’s presentation, Substrate to Baseplate Attach: A Novel Solder Solution with an Embedded Metal Matrix for Enhanced Reliability, discusses the importance of strong, uniform bondline control between the power device and substrate to achieve high mechanical reliability. This is especially important due to power electronics’ changing requirements for functional reliability, particularly in automotive markets. Wilson also examines how Indium Corporation’s InFORMS® technology provides a stable and reliable drop-in solution.
Wilson is an Applications Engineer for Indium Corporation’s European operations. He provides comprehensive technical advice in the selection, use, and application of solder paste, flux, and engineered solders to customers in electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. Wilson has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
