Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at European Power Electronics and Drives’s (EPE) 17th Conference on Power Electronics and Applications, Sept. 8-10 in Geneva, Switzerland.
Vijay’s presentation, Sn+ Heat-Spring® Solder TIMs for Superior Thermal Management, explores how Heat-Spring thermal interface materials (TIMs) perform against phase change materials and thermal greases under a variety of conditions. Vijay will also present comparative results as they relate to power cycling and bake testing, and discuss the advantages of Heat-Spring.
Vijay is based in the U.K. and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and he has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from the State University of New York, Binghamton.
EPE Conference on Power Electronics and Applications is an international exchange on the leading developments in these fields among scientists and industrial experts from around the world.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、马来西亚、新加坡、韩国、英国和美国都有全球技术支持和工厂。
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
