Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will present a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place July 15-17 in Edinburgh, Scotland, United Kingdom.
The presentation, Electrification & Power Modules Innovative High-Reliability Solder Materials, will focus on interconnect solder materials designed to meet the more stringent requirements brought on by increased electrification in automotive and other power electronics applications.
Mission profiles have become harsher with higher service temperatures, increased cycles, and lower Rth, said Vijay. Power module construction is also evolving. This means that the interconnect solder materials for substrate-attach, clip-attach, and module-attach will need to be designed for the newer requirements.
Vijay heads the applications engineering team for customers in Europe, Africa, and the Middle East. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics, focusing on using different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials. He has more than 20 years of experience in electronics assembly and a masters degree in industrial engineering with a specialization in electronics packaging and manufacturing from the State University of New York, Binghamton. He is a Certified SMT Process Engineer and earned his Six Sigma Green Belt certification from Dartmouth Colleges Thayer School of Engineering. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at several industry forums and conferences nationally and internationally.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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