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Indium Corporation Expert to Present at PCIM and SMT Hybrid Packaging 2017

Indium Corporation's Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at PCIM Europe 2017 and SMT Hybrid Packaging on May 16 in Nuremberg, Germany.

Karch will present Performance of Current Flux Systems in Solder Pastes to Increase the Electrical Reliability of Assemblies. He will discuss solder paste flux systems, solder paste performance, and the addition of solder volume for pin-in-paste using Solder Fortification® preforms.

Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation's materials, including solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.

Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂;钎料;热界面材料;溅射靶材;铟、镓、锗、锡金属和无机化合物;以及 NanoFoil®。Indium 公司成立于 1934 年,在中国、马来西亚、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。

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