Indium Corporation Senior Area Technical Manager Jason Chou is set to deliver a presentation at the Power Device & Module Expo, held in conjunction with NEPCON Japan, on January 24 in Tokyo. The presentation will explore trends in EV power electronics and the interconnect materials that enable them.
Interconnect materials play a major role in the efficiency and reliability of power electronics. The adoption of state-of-the-art wide bandgap die technologies such as SiC and GaN, require complementary die-attach materials to maximize the benefits. Higher power densities require new strategies for thermal management and heat dissipation. Packaging trends such as transfer molded modules and the direct bonding to heat-sinks and coolers is an area where different material and process options are considered, each with pros and cons for addressing the challenges of this application.
“As the world moves toward a greener, more sustainable future, the automotive industry is at the forefront of this transformation. EVs have emerged as a key solution for tacking carbon emissions which contribute to climate change, and at the heart of every electric vehicle are power electronics,” said Chou. “In this presentation, I will cover breakthroughs and trends that are shaping the power electronics landscape, especially for EVs.”
As senior area technical manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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