Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics Symposium 2019 (PanPac) in Kauai, Hawaii, USA, Feb. 11-14, 2019.
Dr. Lasky’s presentation, Tin Whiskers 101: Causes, Risks, and Mitigation 2019, will discuss the fundamentals of tin whiskers, the risks they pose in electronics assembly, and techniques to assess and mitigate tin whiskers.
Sjoberg’s presentation, Impact of Stencil Quality & Technology on Solder Paste Printing Performance, will examine the impact of increased miniaturization in packaging and board-level assembly as part of the Internet of Things (IoT), as well as how the resultant move to smaller and finer stencils affects solder paste printing.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned process expert and Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide.
Sjoberg has more than 20 years of technical experience in the electronics assembly industry, including the deployment of leading-edge technologies for packaging and assembly, launching and managing research and development projects and facilities, and serving as a technical advisor to development and manufacturing sites worldwide. He earned his bachelor's degree in electrical engineering from Linköping University, Sweden.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、马来西亚、新加坡、韩国、英国和美国均设有工厂。
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