As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 9-11, in Nuremberg, Germany.
5 月 9 日星期二
- 用于低翘曲功率模块组装的材料：通过低温工艺降低能耗和二氧化碳排放量 由区域技术经理和高级应用技术专家提供 安德烈亚斯-卡奇
- 本讲座探讨了不同的材料特性，如 CTE（热膨胀系数），这些特性会在较高的工艺温度下造成组装困难。在焊接过程中降低峰值温度可以解决这一问题，并节省额外的能源。
- 演讲将以德语进行。
5 月 10 日星期三
- 电力电子材料与工艺优化 作者：ESM/电力电子产品经理 乔-赫特莱恩
- 本讲座将分析关键的电源模块封装架构以及相应的焊接、烧结、热界面和装配材料解决方案，这些解决方案可延长产品寿命、实现制造可扩展性并降低拥有成本。
- 烧结材料技术在电动汽车动力模块应用中的作用 作者：半导体产品经理 迪安-佩恩
- 在本次演讲中，Dean 将探讨烧结技术如何应用于芯片贴装和基板贴装，以及这种材料的技术进步如何使电动汽车电源模块组装的制造流程更加高效。
Click here for additional information, including times and locations for all Indium Corporation presentations at PCIM. All presentations will be given in English unless otherwise noted.
Andreas provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to our customers in Europe.
Joe is responsible for driving the growth of Indium Corporation’s power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Joe also collaborates with Indium Corporation’s sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).
Dean is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which includes high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #460.
关于铟泰铟泰公司
铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物，以及NanoFoil™（ ）。公司创立于1934年，拥有全球技术支持体系，工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。
如需了解更多铟泰公司信息，请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"（，#FOETA）的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
关于 PCIM 欧洲
欧洲 PCIM 展览会是电力电子及其应用领域的国际领先展会。该展会为国际观众提供了了解整个价值链产品、发现最新趋势以及与来自世界各地的专家交流的机会。了解更多信息，请访问pcim.mesago.com。
