Indium Corporation has released NC-702, a no-clean, near-zero residue, halogen-free adhesive solution designed for holding parts in place during placement and reflow processes.
Designed for use in a formic acid reflow environment, NC-702 is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution over pick and place investments. While NC-702 has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps. Benefits include:
- No evidence of contamination during reflow, enabling use in formic acid reflow environments without risk of damaging equipment
- Flexible application method via dipping, dispensing, or jetting, potentially reducing process costs
- Minimal voiding present and good soldering performance; although classified as an adhesive solution, NC-702 does not negatively affect soldering performance
- Compatible with molding and underfill material
- Compatible with most common SAC alloys
For more information about NC-702, contact Indium Corporation Product Specialist Evan Griffith
关于铟泰铟泰公司
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料精炼商、冶炼商、制造商和供应商。 产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度 、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
