CLINTON, N.Y., March 18, 2026 — Indium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance, while addressing power electronics cost pressures at APEC 2026, March 22-26, in San Antonio, Texas.
The presentation, Sinter Pastes for Industry Standard and State-of-the-Art Power Electronics Assembly, will demonstrate that as cost-reduction demands increase across the industry, copper sinter pastes offer thermal and electrical performance comparable to silver at a lower expense. Case study solutions discussed include pressureless copper sinter for discrete SiC TO-247 packages and pressure-assisted pastes for SiC die-attach on ceramic substrates, and large-area heat-sink attachment in advanced high-power electronics applications.
Dean Payne is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. Payne collaborates with internal departments, including sales, technical service, R&D, production, and quality, providing support for all semiconductor and advanced assembly materials.
APEC 2026 visitors can attend Payne’s presentation on Wednesday, March 25, at 12:00 p.m. CST. To learn more about Indium Corporation’s power electronics and solder solutions, visit indium.com or meet with our experts at APEC booth #1553.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。您还可以通过www.linkedin.com/company/indium-corporation/ 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
