Indium Corporation earned Electronics Manufacturing (EM) World‘s Innovation Award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.
EM 创新奖计划旨在表彰电子行业的卓越成就，鼓励企业达到最高标准，推动行业发展。
We are honored to have Indium12.8HF recognized by EM World, said Evan Griffith, product specialist. As miniaturization continues its spread throughout all corners of the industry, more applications must adapt to finer pitches and smaller packages with paste deposits which may be unachievable by stencil printing. Its critical to Indium Corporation that we produce innovative, proven products that provide solutions to the current and emerging challenges.
Indium12.8HF is a no-clean, halogen-free solder paste that is inherently compatible with Indium Corporations best-selling solder pasteIndium8.9HFand is optimized for long-term jetting and microdispense applications. Indium12.8HF has proven to be useful in a wide range of applications, including MEMS and MiniLED assembly, which require precision dot diameter/line width deposits down to 80m, as well as offering consistent, reliable dispensability without skips through a day of use.
此外，铟12.8HF：
- 符合 IPC J-STD-004B 第 1 修正案 ROL0 的要求
- Offers exceptional electrical reliability
- Minimizes graping and similar reflow issues with a unique flux oxidation barrier formulation
- Delivers aesthetically pleasing clear residue with minimal flow-out
- 与同类焊膏相比，回流焊飞溅最小
- Has a long working (syringe) life
To learn more about Indium12.8HF jetting and microdispensing solder paste, visit indiumstg.wpenginepowered.com/jetting-paste.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
关于电子制造（EM）世界
EM World provides the latest information in the industry for professionals engaged in PCB component design, assembly, and testing in Asia; it has also become a contract manufacturer (EMS/ODM) and an OEM company and provides them with equipment, materials, and software. It is considered the authoritative magazine to learn about the latest development trends for SMT, electronic packaging, and interconnection technology with the overall solution supplier/agent.
