Indium Corporation was presented with the SMT China Vision Award for its Indium10.1 solder paste at NEPCON China on April 21 in Shanghai, China.
SMT China Vision 奖旨在表彰在SMT方法、工艺、材料、设备、软件和管理服务方面拥有创新产品和技术的国内外公司。每项参选产品均根据其创造性、技术先进性以及对降低成本、改善质量、提高效率、增强可靠性、确保安全和保护环境的贡献进行评估。
Indium10.1是一种无铅含卤素焊膏，对于 QFN、BGA 和带大接地平面的焊盘，其空洞度最低。
Indium10.1的氧化抑制特性可提供业界领先的枕头和抗划痕性能，即使在长时间回流焊后也能完全凝聚。Indium10.1的卓越焊接能力使其成为可焊性不理想的元件和具有挑战性的射频屏蔽金属化的最佳解决方案。
Indium10.1 具有同类最佳的印刷和焊接性能，包括同类最佳的印刷清晰度和传输效率、低空泡性能、抗枕木头和抗划伤性，可为印刷电路板组装制造商提供最低的拥有成本。
For more information about Indium10.1 or Indium Corporation's complete Pb-free solder paste series, visit www.indium.com/indium10.1, or email [email protected].
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
