Indium Corporation is set to showcase its advanced metal thermal interface materials (TIMs) for burn-in and test at TestConX 2024, March 3-6 in Mesa, Ariz., U.S.
As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase selections from its array of high-performance metal TIM solutions.
Renowned for their superior thermal conductivity compared to non-metals, Indium Corporation’s indium-containing TIMs for burn-in and test stand out, with pure indium metal delivering 86W/mK. These TIMs are available in various forms, including pure indium, indium-silver alloys, and indium-tin. The pure indium TIM can be optionally clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent indium from adhering to the surface. Indium Corporation’s suite of standard Heat-Spring solutions, which feature a compressible interface between a heat source and a heat-sink, include:
热泉 HSD
- 对于表面平整、光滑和平行的接口，这是独创的最佳标准选项。
- 专为具有严格表面控制 >30psi 的接口而设计
Heat-Spring High Profile Preforms
- 图案设计优化了与非平面表面的接触，可提供 86W/mK 的功率
- 非常适合使用挤压、无鳍散热片的组件
- Recommended for immersion cooling and Burn-In applications
- 确保老化头与测试设备 ( DUT )之间保持均匀接触
- 提供更均匀的热导率
- 可回收和再生
热弹簧 HSK
- 特别推荐用于需要多次插拔应用
- 可提供均匀的接触面，且接触电阻低，适用于密度 负荷
- 通常覆有一层薄的扩散屏障，该屏障在预烧测试 应用用作接触面
- 无污渍或开裂
To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX or online at indium.com/TIM.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
