Indium Corporation’s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.
Dr. Liu’s presentation, An Innovative Composite Solder Preform for TLP Bonding — Microstructure and Properties of Die-Attach Joints, discusses a special laminate composite preform developed for high temperature Pb-free soldering applications, where a melting temperature of 280°C or higher is required.
Dr. Liu has published over 70 research papers in the area of materials joining and processing, and has received several “best paper” awards at international conferences. He received the American Welding Society’s Masubuchi Award in 2004 for "an outstanding scientist under the age of 40 who has made significant contributions in the advancement of the science and technology of materials joining through research and development." He was included in the Marquis Who’s Who in America and Marquis Who’s Who in Science. Liu has a PhD in Materials Science and Engineering from the Harbin Institute of Technology.
EPTC is an international event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society. EPTC 2013 will feature technical sessions, short courses and forums, an exhibition, and social and networking activities. It provides coverage of technological developments in all areas of electronics packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.
铟泰公司 是一家面向全球电子、半导体、太阳能、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。Indium公司成立于1934年，拥有全球技术支持团队，并在中国、新加坡 、韩国、英国和美国设有工厂。
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