Indium Corporation will feature its innovative high-reliability, low-temperature alloy system during the virtual IPC APEX Expo, to be held March 8-12.
Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT provides superior drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
Durafuse™ LT：
- 为热敏元器件 柔性聚合物提供解决方案
- 防止处理器元器件 多层电路板因热膨胀而变形
- 满足阶梯焊接的低温 ，特别适用于射频屏蔽件的安装、底部填充材料 后的处理以及返修 应用
For more information about Indium Corporation’s Durafuse™ LT, visit its virtual show booth or indiumstg.wpenginepowered.com/durafuse.
关于铟泰铟泰公司
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
About IPC APEX EXPO 2021
IPC APEX EXPO is one of the premier events for the electronics manufacturing industry, providing a virtual platform for attendees, exhibitors, and speakers to easily navigate more than 100 technical conference sessions and professional development courses as well as product demonstrations. New this year, technical conference sessions will be available to registered attendees for replay, providing a unique opportunity to take advantage of education for up to 90 days after the event. Learn more at www.ipcapexexpo.org.
