Indium Corporations Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications. The webinar, part of Indium Corporations free InSIDER Series, will be hosted on LinkedIn Live on April 17 at 11 a.m. EST.
Dr. Geng will evaluate a novel lead-free solder paste developed using Indium Corporations patented Durafuse mixed-alloy technology, Durafuse HR (DFHR). Demonstrating the merits of each constituent solder powder in the paste, DFHR delivers enhanced thermal cycling performance (-40C/125C and -40C/150C) and superior voiding performance for high-reliability automotive applications.
Among other features such as versatile compatibility with SAC305 reflow profiles, Durafuse HR shows dramatically improved voiding performance along with high thermal fatigue resistance compared to SAC305 and other high-reliability solder pastes, said Dr. Geng. I believe that this technology has the ability to revolutionize automotive soldering processes, and I look forward to sharing this exciting data with my industry colleagues.
As Senior Research Metallurgist, Dr. Geng leads research projects and works innovatively to deliver timely solutions for both customers and the market. He designs implementation and adjustments of experiments, analyzes the root cause of product failures to create solutions, and trains and leads research associates in laboratory projects. Since joining Indium Corporation in 2016, he has excelled in technology development, as demonstrated by his recent success with Indalloy292 and Durafuse HR. Dr. Geng holds a doctorate in metallurgy, a masters degree in materials science, and a bachelors degree in materials science and engineering.
Click here to register for this free and insightful session debuting on LinkedIn Live. The webinar will also be made available for on-demand viewing afterward at indium.com/webinars.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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