Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen will present a technical paper at SEMI-THERM, taking place March 1317 in San Jose, CA.
The presentation, titled Innovative Next Generation Metal TIM Technology for HPC Applications, will address the use of solder thermal interface materials (sTIMs) for heat dissipation in high-performance computing (HPC) applications. sTIMs have been used as a TIM1 solution for a limited set of server packages for over 20 years. A sTIM interface has the potential to provide extremely high amounts of heat dissipation. Because of increasing power and functionality of HPC packages, many of the traditional polymer TIM materials are reaching their physical limits for heat dissipation and are no longer adequate. This is creating an interest in using metal TIMs in a broader array of applications.
At Indium Corporation, Jensen leads a matrixed team focused on engaging customers and commercializing new technology for our Thermal Interface Material products, including technology for 5G and AI. He is responsible for ensuring the product line is poised for long-term success by developing technologies that best meet the current and future needs of customers. He has authored numerous technical papers on soldering and thermal technology. In addition to his responsibilities at Indium Corporation, Jensen also serves on the SMTAs Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. He has a bachelors degree in chemical engineering from Clarkson University and an MBA from Syracuse University.
关于铟泰铟泰公司
铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物，以及NanoFoil™（ ）。公司创立于1934年，拥有全球技术支持体系，工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。
如需了解更多铟泰公司信息，请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"（，#FOETA）的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
About SEMI-THERM
SEMI-THERM is an international forum dedicated to the thermal management and characterization of electronic components and systems. It provides knowledge covering all thermal length scales from IC to facility level. The symposium fosters the exchange of knowledge between thermal engineers, professionals, and leading experts from industry, as well as the exchange of information on the latest academic and industrial advances in electronics thermal management.
