As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its industry-leading Durafuse solder technology at the Battery Show North America, October 8-10, in Detroit, Michigan.
Indium Corporation will showcase the following among its featured products:
- Durafuse LT 是一种屡获殊荣的焊膏合金系统，具有多功能特性，可实现节能、高可靠性和低温步进焊接。它是具有较大温度梯度和复杂翘曲曲线的大型 BGA 组装的理想选择。Durafuse LT 具有卓越的跌落冲击性能，优于 BiSn 或 BiSnAg 合金等传统低温焊料，在最佳工艺设置下甚至优于 SAC305。
- Durafuse HR 基于新型焊膏合金技术，具有更强的热循环性能（-40C/125C 和 -40C/150C）和优异的空化性能，适用于高可靠性汽车应用。它还能减少焊点开裂，提高剪切强度。
- 用于预型件/InFORMS 的Indalloy301LT 合金是一种新型无铅合金，与 SAC 合金相比，它能降低预型件焊接的加工温度。
Indium Corporations innovative solder and alloy technologies are designed to meet the stringent requirements of the electric vehicle market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry’s drive towards sustainability and longer-lasting products. By offering advanced materials solutions like Durafuse and Indalloy, Indium Corporation helps automakers and battery manufacturers tackle the challenges of electrification and develop next-generation EV technologies.
欲了解 Indium Corporations 解决方案的更多信息，请参观我们在底特律电池展 A-C 厅 733 号展位的专家团队。
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
