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Indium Corporation’s Lasky Outlines History, Applications, and Future of Indium

Indium Corporation's Dr. Ron Lasky, Senior Technologist, delivers an informative overview of the history of, and insight into the future use of, indium metal in a video available at indiumstg.wpenginepowered.com/blog/phil-zarrow.

As part of the Electronics Assembly with Phil Zarrow series, this video features Lasky and SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discussing historical and unique indium and indium alloy applications.

“Indium Corporation was the first company to find a practical use for indium in the 1930s, and that was for bearing lubricants in aircraft. It was used in solders and fusible alloys,” Lasky explains. “Today, one of the more interesting applications is that indium can be used as a superconductor, and it has a high nuclear cross-section for neutrons, so it's often used in nuclear control rods.”

For more information on indium, high-purity indium, and indium alloys, visit indiumstg.wpenginepowered.com/metals/indium.

Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned process expert and a Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at indiumstg.wpenginepowered.com/drlasky.

Zarrow 从事印刷电路板制造和组装工作已超过 35 年。除了自动化装配和清洁方面的背景外,Zarrow 在表面贴装回流焊接技术、SMT 贴装设备和回流焊接系统的设计和实施方面的专业知识也得到了认可。他丰富的实践经验还包括在世界各地设置通孔和 SMT 工艺并排除故障。

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.