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Indium Corporation's high-purity indium is refined using advanced processes that are controlled with rigorous quality standards. Purity is verified using advanced analytical instrumentation such

Indium Corporation will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in

Indium Corporation, Utica’s Technology Company®, will host a job fair for more than 30 open full-time positions on October 19 from 10:30 a.m.-6 p.m. at the Radisson Hotel-Utica Centre, 200

Indium Corporation’s Dr. Yan Liu, Research Chemist, will present at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers Avoid the Void® at Productronica, November 14-17, in Munich, Germany. The

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation's portfolio of solder pastes have been designed to meet the current and evolving challenges

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his expertise on Interconnect Materials for SiP Packaging at the inaugural SiP Conferences

Indium Corporation, Utica’s Technology Company®, announces the promotions of Jim McCoy and Jeff Rivet. Jim McCoy has been named Talent Acquisition Supervisor. McCoy is responsible for

Indium Corporation has expanded the responsibilities of its global leadership team with the promotion of several top

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her perspective on supply and demand in the European mining and metals industry at the Minor Metals

Indium Corporation, Utica’s Technology Company®, will showcase its breadth of manufacturing careers through an interactive display at this year’s SUNY Poly Manufacturing Day

Indium Corporation experts will share their knowledge and expertise at IMAPS 50th International Symposium on Microelectronics, Oct. 10-12, in Raleigh, NC. Vice President of

Indium Corporation has launched Indium10.1HF Solder Paste, a new solder paste specifically formulated to achieve ultra-low voiding in bottom termination component (BTC) assemblies and improve

Indium Corporation’s Pony Liao, Area Technical Manager for Northern China, hosted a WeChat webinar on Aug. 16 and detailed Special Alloys for Step Soldering and Thermal Management. In

Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2017 in Taipei, Taiwan. Indium Corporation’s Indium3.2HF is an air or nitrogen reflow,

Indium Corporation will demonstrate its low-voiding solder products "Live@NEPCON South China" at NEPCON South China from August 29-31, in Shenzhen. Live@NEPCON South China is

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at IMAPS 50th Anniversary Symposium, Oct. 10-12, in Raleigh, N.C. Indium Corporation is

Indium Corporation will co-host a seminar with Process Lab.Micron on Advanced Void-Reducing Technologies for Infrastructure and Communications on Aug. 24 in Shanghai. The seminar will

Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the SMTA International

Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Technical Conference, Sept. 17-21 in Rosemont, Ill. The following technical papers

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the Electronic Design Innovation Conference (EDI CON) and Exhibition