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Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo. Indium Corporation’s Indium8.9HF and

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, has been bestowed the prestigious title of Fellow of the Institute of Electrical & Electronics Engineers (IEEE)

Indium Corporation has released a new solder research kit designed for soldering to gold plating using indium-based alloys. Gold is often used in electronics assembly because it resists

Indium Corporation's Dr. Ron Lasky, Senior Technologist, discusses the importance of indium tin oxide (ITO) in touchscreen and flat panel technology in a new video available

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at NEPCON Japan 2017 on Jan. 18-20 in Tokyo, Japan. Indium8.9HF is specifically formulated

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at IPC APEX Expo on Feb. 11-16 in San Diego, Calif. Indium8.9HF is a no-clean,

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in

As part of the Electronics Assembly with Phil Zarrow video series, Indium Corporation's Bill Jackson, Director and General Manager of Compounds, and SMT expert Phil Zarrow,

Indium Corporation's Pat Ryan, America's Sales Manager, will present Voiding Under Bottom-Terminated Components at the SMTA Space Coast Expo & Tech Forum on Nov.

Indium Corporation was presented with the Business Leadership Award at the New York Association of Training & Employment Professional’s (NYATEP) 2016 Statewide Workforce Awards

Indium Corporation announces that Jingya Huang has joined the company as Marketing Communications Assistant Manager. Huang is responsible for creating and managing promotional and branding

Indium Corporation, Utica’s Technology Company®, has hired Brian Freiberger as Senior Maintenance Manager. He is based in the company’s Clinton, N.Y. ECD facility and is responsible

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will lead a workshop titled Materials Considerations for Achieving High-Reliability Lead-Free Soldering at

Indium Corporation's Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at Kulicke & Soffa's Technology Seminar on November 9-10.

Indium Corporation's Dr. Ron Lasky, Senior Technologist, delivers an informative overview of the history of, and insight into the future use of, indium metal in a video available

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will deliver a technical presentation at the IMAPS Autumn Conference on Oct.

Indium Corporation’s Ivan Castellanos, Technical Services Manager, Latin America, recently hosted the highest-attended SMT Processes Certification course ever, with 34 attendees.

Indium Corporation was presented with the Global Technology Award for Solder Paste for Indium10.1HF Solder Paste at SMTA International (SMTAI) Conference in Rosemont, Ill. Indium10.1HF Solder

Indium Corporation’s Jason Chou, Area Technical Manager for Taiwan, and Kenny Chiong, Senior Technical Support Engineer, will present at 2016 Electronics Packaging Technology Conference (EPTC)

Indium Corporation's newest informational video provides an overview of the versatility of indium when alloyed with other metals. This brief video, which can be found at

Indium Corporation's Ron Hunadi, Market Development Manager, Semiconductor and Advanced Materials, will share his knowledge and expertise at IMAPS Advanced Technology Workshop and