生物
As Principal Engineer for Advanced Materials, Dr. Mackie focuses on identifying the intersection of novel materials, emerging technologies, and their potential business impact. His professional experience covers all aspects of materials and processes for electronics manufacturing from wafer fabrication to semiconductor assembly and packaging and SMT/electronics assembly.
认证
IMAPS 研究员
获奖情况
IMAPS William D. Ashman Achievement Award (2014) for leadership and technical contributions to the semiconductor packaging industry
IPC President’s Award (2001) for leadership in the Solder Paste Task Group, and the Assembly and Joining Materials sub-committee
教育
英国诺丁汉大学物理化学博士，英国布里斯托尔大学物理化学和表面科学理学硕士（MSc）