很多不熟悉半导体产品的人都觉得它们令人生畏。我也曾觉得它们令人生畏，但现在我意识到，半导体磁通量并不 "可怕"。事实上，作为一名工程师，它们可以成为你口袋里的重要资源。
我们提供的部分半导体助焊剂包括倒装芯片助焊剂、晶圆凸块助焊剂和球形贴片助焊剂。
首先，我要谈谈倒装芯片助焊剂。倒装芯片助焊剂通常是中低粘度的助焊剂。这些助焊剂可以是水溶性的，也可以是免清洗的，有助于在回流焊过程中去除焊接凸点或铜柱微凸点上的氧化物。
Cu pillars topped with solder micro-bumps are becoming more and more popular.However, as these devices become smaller and more fine-pitch the package becomes more prone to warpage during the reflow process.This, in conjunction with wetting of the surface and the amount of oxidation on the surface, can make flip-chip assembly challenging.To address all these new challenges, you need a proper flux that can wet the surface, clean the oxides, and still keep the flip-chip in place during reflow.This is where the rheology, as well as the chemistry, plays a critical role.Indium Corporation has devoted significant resources to fully understand the rheology and chemistry of our fluxes so we can recommend just the right flux for your application – whether you need a water-soluble, no-clean or even an ultra-low residue flux.
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