Indium Corporation Strategic Advisor Dr. Dongkai Shangguan is scheduled to deliver a keynote presentation at NordPac, hosted by IMAPS, June 12-14, in Oslo, Norway.
演讲的题目是 "互连可靠性"：从芯片到系统》为题，探讨了互连可靠性对半导体封装和电子系统整体完整性的重要性。随着满足高密度和高性能需求的新型互连技术的出现，互连可靠性变得越来越复杂和关键。异构集成的日益广泛采用导致同一封装中的互连（具有不同的几何形状、材料和接口）日益多样化，并带来复杂（而且往往是交互式）的可靠性失效模式和机制。
"上官博士说："作为来自学术界和工业界的微电子封装专家的国际盛会，NordPac是一个讨论整个领域正在进行的突破性研究的极具价值的论坛。"我很荣幸 IMAPS 邀请我在这一重要会议上为我尊敬的同行们做主题演讲。
Dr. Shangguan is a Strategic Advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also served as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a bachelor’s degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books, more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 30 U.S. patents and several foreign patents.
关于铟泰铟泰公司
铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物，以及NanoFoil™（ ）。公司创立于1934年，拥有全球技术支持体系，工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。
如需了解更多铟泰公司信息，请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"（，#FOETA）的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
关于 IMAPS
国际微电子组装与封装协会（IMAPS）是致力于通过专业教育促进微电子和电子封装技术进步与发展的最大协会。学会的技术组合通过顶级专业活动、独家微电子封装研究图书馆、地方分会网络和其他工作进行传播。协会成立于 1967 年，当时名为 ISHM，后于 1996 年与国际电子与封装协会 (IEPS) 合并，至今已有 50 多年的网络、教育和出版历史。
