焊料合金
Durafuse®HR
Durafuse® HR is a patented mixed solder paste alloy developed by Indium Corporation to achieve low voiding without the need for vacuum reflow in high-reliability applications, such as automotive and aerospace. Durafuse® HR offers a unique option with distinct advantages for high-reliability solder paste.
技术支持：铟泰公司
- Low Voiding Without Vacuum Reflow
- Enhanced Thermal Cycling Performance
- 可持续性
产品概览
Low Voiding
Traditionally, high-reliability solder pastes are linked to high voiding and require vacuum reflow setups to meet low-voiding requirements. Durafuse® HR, however, achieves low voiding without compromising time to market.
Thermal Cycling Reliability
Working up to 3,000 cycles at -40°C/125°C, Durafuse® HR delivers exceptional thermal cycling performance for extended mission profiles, reducing risk of cracking and enhancing shear strength.
与 SAC 配置文件兼容
Durafuse® HR 采用与 SAC 非常相似的型材，并与 SAC 工艺条件兼容，因此工艺调整所需的时间更短，成本更低。
产品数据表
Durafuse® HR (Indium12.9HF) High-Reliability Alloy Technology PDS 100463 R0.pdf
Durafuse® HR (Indium10.2HFA) High-Reliability Alloy Technology PDS 100126 R3.pdf
Durafuse® HR (Indium8.9HFRV) High-Reliability Alloy Technology PDS 100064 R8.pdf
Durafuse®HR含铟3.2HF PDS 100310 (A4) R0.pdf
相关应用
Durafuse® HR is usable in a variety of high-reliability applications.
PCB
经过验证且处于行业前沿PCB 组装材料PCB
High-Reliability
Various options for various high-reliability PCBA applications.
相关市场
Durafuse® HR is used in markets that require high reliability.
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焊料合金
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