Seth Homer: As we've discussed, there are three attach levels of peak concern in the IGBT stack up. At Indium Corporation, we're redefining how we use solder at the die-attach, substrate, and baseplate to heat-sink levels, so we can achieve a more reliable IGBT that can perform increasingly higher standards. If you missed the first two videos in this series, be sure to check them out at www.indium.com/IGBT.
今天，我们重点讨论堆叠的基底层。基板上可能连接有多个芯片，因此焊接极为重要。为了保持性能和可靠性，这一层需要克服自身的特殊挑战。与底部终端元件面临的挑战类似，基板也容易出现空洞。为确保达到最佳效果，许多装配商选择使用无助焊剂真空回流焊解决方案和还原气氛，以实现最低的空洞率；然而，即使在这种情况下，焊接质量也会对空洞率产生不利影响。
合金纯度和百分比也非常重要。在无法使用无助熔剂真空回流焊的情况下，可能需要使用助熔剂。这很棘手，因为挥发物也会导致空洞。正因为如此，高度工程化的助焊剂涂层才是最好的方法。除了空泡外，键合线共面性也很关键。由于元件较大，液态焊料可能无法在回流过程中均匀地支撑元件的重量。这会导致键合线不均匀，从而增加循环过程中的应力区域。
So, how can you achieve superior performance at the DBC substrate to baseplate level? The answer is to add a reinforcement matrix to the solder to act as a stand off. This creates constancy in the bondline thickness and adds strength laterally, resulting in enhanced thermal cycling survivability. Indium Corporation’s InFORMS® are reinforced solder preforms that are specifically designed to preserve the bondline co-planarity and add strength to the joint, increasing reliability to the process.
有关此主题的更多信息，请下载我们最近的技术文章《减少基底倾斜和改善粘结线控制的新技术》或访问www.indium.com/informs。此外，请随时直接与我联系[email protected]。谢谢。
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