Flux
Ball-Attach Flux: WS-575-C-RT (VIDEO)
Currently, for the ball-attach process, customers are facing issues like warpage of the substrates......
Flux Challenges Regarding Flip-Chip/BGA Balling
This video is for anyone interested in the flux challenges associated with flip-chip/BGA balling. Keywords: Phil Zarrow, Andy Mackie, Indium Corporati...
One-Step Soldering in Flip-Chip Assembly
This video is for anyone interested in flip-chip/BGA balling using the one-step assembly process. Keywords: Phil Zarrow, Andy Mackie, amackie@indium.c...
Voiding in Flux-Cored Wire
Voiding in flux-cored wire causes serious problems. Learn about the causes of voiding and a way to Avoid The Void®...
No-Clean Fluxes in Semiconductor Assembly
We explore cleaning techniques for Internet of Things (IoT) devices. It will cover water-soluble and no-clean materials and process....
80Au20Sn: Superior Physical Properties
In my previous post we saw that 80Au/20Sn eutectic alloy performs as both a solder or a braze. This is due to its unique and valuable properties. Let&...
Rosin In Soldering Fluxes: A Complex Material
All rosins are resins, but not all resins are rosins. We owe the fact that we classify fluxes as rosin to pine tree sap having fluxing properties whil...
REACH-Compliant Solder Fluxes for Europe
One of the key components of the soldering process is the flux. Without the right flux to remove the oxides, then you can end up with a poo...
What is an Intern to Do?
The Indium Corporation has many summer interns this year. The technical support group was fortunate enough to hire Sarah Bjornland (pictured). She is ...
Preheating Part VII - Lamp-Type Infrared and Ceramic Plate
Lamp style preheaters have the fastest response time of any of the previous preheaters mentioned in other posts. The lamp filament is practicall...
Applying Solder Preforms - Testing the Assembly
Finally – the fun part! After all of your work specifying the right materials and applying them, at last we can test all of the assumptions we h...