Process Considerations for QFN Voiding in SMT Electronics Assembly (2/3)
This is part two of a three-part series. This video is for anyone interested in the design of experiment aspect of Avoid the Void®......
This is part two of a three-part series. This video is for anyone interested in the design of experiment aspect of Avoid the Void®......
This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of Avoid the Void®......
Gold-plated surfaces are widely used in electronics assembly, but using common tin-based solder alloys can scavenge the gold. There's a better sol...
A paper presented at SMTAI 2016 on reducing voids in bottom-terminated components......
A preform is a piece of solder (available in a wide variety of shapes)....
Indium metal has a positive environmental impact in our customers' applications....
Currently, for the ball-attach process, customers are facing issues like warpage of the substrates......
There exists a wide range of assembly products for the SiP process, especially solder pastes....
Lucia is our 2016 Marcom intern. Here is her perspective after working at Indium Corporation for 9 weeks....
College intern Sean McKenna's thoughts on the differences between his experience as an intern and his experiences with a traditional summer job....
Lindsay has utilized her knowledge of chemistry to explore two very different roles of a scientist: Product development and application research....