Posted On: August 28th, 2018 | By: Phil Zarrow

Tech Seconds: How to Troubleshoot Head-in-Pillow (HIP) Defects

In this installment of Tech Seconds, Phil examines the best methods used to troubleshoot head-in-pillow (HIP) defects ...

Posted On: August 21st, 2018 | By: Phil Zarrow

Tech Seconds: X-ray Analysis Electronics Assembly

In this installment of Tech Seconds, Phil discusses the basics of X-ray analysis for electronics assembly and how to identify soldering voids....

Posted On: August 14th, 2018 | By: Phil Zarrow

Tech Seconds: How to Eliminate Head-in-Pillow (HIP) Defects

In this installment of Tech Seconds, Phil describes how to diagnose defects caused by head-in-pillow (HIP). ...

Posted On: August 7th, 2018 | By: Phil Zarrow

Tech Seconds: Troubleshooting Voiding

In this installment of Tech Seconds, Phil outlines how to effectively troubleshoot voiding issues when a customer notices an increase in the amount of...

Posted On: July 31st, 2018 | By: Phil Zarrow

Tech Seconds: Voiding - Symptom or Defect?

How do you determine whether your voids are a symptom or a defect. Phil Zarrow gives his advice. ...

Posted On: July 24th, 2018 | By: Phil Zarrow

Tech Seconds: How to Interpret Ion Chromatography (IC) Results

What should you consider them you analyze ion chromatography results? ...

Posted On: July 17th, 2018 | By: Phil Zarrow & Indium Corporation®

An Overview of Vacuum Reflow Soldering

Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss approaches for reaching near zero voiding and how v...

Posted On: July 10th, 2018 | By: Phil Zarrow

Choosing Flux-Coated Solder Preforms

Kimberly Flanagan, Technical Support Engineer, and Phil Zarrow examine the benefits of flux-coated solder preforms, and how they can improve the manuf...