Tech Seconds: How to Eliminate Head-in-Pillow (HIP) Defects
In this installment of Tech Seconds, Phil describes how to diagnose defects caused by head-in-pillow (HIP). ...
Indium Corporation
Tech Seconds: Troubleshooting Voiding
In this installment of Tech Seconds, Phil outlines how to effectively troubleshoot voiding issues when a customer notices an increase in the amount of...
Tech Seconds: Voiding - Symptom or Defect?
How do you determine whether your voids are a symptom or a defect. Phil Zarrow gives his advice. ...
Tech Seconds: How to Interpret Ion Chromatography (IC) Results
What should you consider them you analyze ion chromatography results? ...
An Overview of Vacuum Reflow Soldering
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss approaches for reaching near zero voiding and how v...
Choosing Flux-Coated Solder Preforms
Kimberly Flanagan, Technical Support Engineer, and Phil Zarrow examine the benefits of flux-coated solder preforms, and how they can improve the manuf...
Benefits of Solder Fortification Preforms
Kimberly Flanagan, Technical Support Engineer, and Phil Zarrow discuss how Solder Fortification® Preforms can help reduce voiding and increase joi...
2018 International Microwave Symposium
Comes see us at the International Microwave show on June 12-14. We’ll be highlighting our high-temperature product along with many other pr...
Confronting Writer's Block
How I overcame my writer's block to re-energize my technical and creative blog writing. A change of focus - and scenery - was ...
APEX 2018: Live@APEX & Poster Presentation on Solder Fortification and QFN Void Reduction
Visit Indium Corporation at APEX 2018 in San Diego, CA February 27th through March 1st....
The Indium Materials Blog: a Year in Review
With the start of 2018, we look back on a year that has been quite exciting here on the indium materials blog....
What Drives Us?
The curious and motivated pioneers of indium developed the base of knowledge we still use today to specify indium for new applications. ...