Using ANOVA to Compare Three or More Solder Pastes for a Metric-Like Transfer Efficiency
An Interview with Professor Patty Coleman....
An Interview with Professor Patty Coleman....
Folks, Good friends Phil Zarrow and Jim Hall did an episode on their world famous “podcast” “Boardtalk” on the importance of r...
Folks, This year SMTAI is in Minneapolis from October 9 to October 12. I will be giving a paper on hotbar soldering in the morning on Thursday October...
Folks, Digikey colleague Aaron Rollens developed the equation to convert the mass on a spool of solder wire into its length. I also developed the equa...
Folks, Let’s assume you would like to estimate the upper confidence limit of a failure rate. As an example, assume you have 21 samples of 1000 t...
Folks, You are the project manager for a PCB that must function in an environment from -10 to 80 C. The PCB will experience one thermal cycle per day ...
Folks, In my last post, I discussed the concern for copper-tin intermetallic (IMC) growth in solder joints at high service temperatures. Since then, I...
SIR Testing-Surface and Insulation Resistance testing, a form of standard testing where you measure the electrical reliability of a no-clean or a...
The introduction point between the pad and the soldeirng iron tip plays a crucial role in creating perfect solder joints, as well as gives clues as to...