Posted On: February 10th, 2015 | By: Adam Murling

Fluxless Soldering

When I was learning about solder, I was very surprised when I......

Posted On: December 19th, 2014 | By: Indium Corporation®

Who Makes Your Solder Preforms?

This year I’ve had the chance to work, and become friends, with Bryan Dygert, one of our solder preform manufacturing work cell operators at the...

Posted On: October 20th, 2014 | By: Ed Briggs

SMT Optimization For Success - Part 6: The Effect of Solder Particle Size on Printing Using Ultrafine Stencil Apertures

SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post...

Posted On: October 6th, 2014 | By: Indium Corporation®

Partially Cleaning No-Clean Solder Paste - the Godzilla effect

The other day I was watching the classic film “King Kong vs Godzilla” with my son. At one point, I believe related to some prequel t...

Posted On: September 2nd, 2014 | By: Dr. Andy Mackie

Ultralow Residue Flip-Chip Fluxes: Semicon Taiwan

It’s often helpful to overhear good things being said about you. I attended a supplier meeting in Los Angeles in March, and overheard two senior...

Posted On: July 14th, 2014 | By: Ed Briggs

SMT Optimization for Success Part 3: Flux Chemistry

SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...

Posted On: June 27th, 2014 | By: Eric Bastow

The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Residues

At APEX 2014, I presented a paper about the effect that reflow profiling has on the SIR (Surface Insulation Resistance) performance (electrical reliab...

Posted On: May 5th, 2014 | By: Eric Bastow

High Reliability Solder Preform Flux Coating for the Telecom Industry

The telecom industry relies heavily on Telcordia (Bellcore) testing to determine the electrical reliability of no-clean solder flux residues. There ar...

Posted On: March 31st, 2014 | By: Eric Bastow

What a J-STD-004 classification of "OR" means and what it doesn't mean

Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recogn...

Posted On: February 9th, 2014 | By: Indium Corporation®

One-Step OSP BGA Soldering Application

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex...