Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, shared his expertise during two professional development courses at the 19th International Conference on Electronic Packaging Technology (ICEPT 2018) on Aug. 8 in Shanghai, China.
Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration detailed the material considerations required for achieving high-reliability in lead-free solder joints. The goal of this course was to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
The second course, Power Electronic Packaging Reliability, Materials, Assembly and Simulation, educated participants on the lead-free materials best used to achieve high-reliability solder joints in power electronics at varying temperatures.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys and solder pastes for SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、および熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer ToAnother®（#FOETA）」を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
