April 26, 2018
Indium Corporation has earned the SMT China Vision Award for its Indium10.1HF Solder Paste on April 24 at NEPCON China.
The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its creativeness, technological advancement, and contributions to help reduce cost, improve quality, increase efficiency, enhance reliability, ensure safety, and protect the environment.
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom terminated component (BTC) assemblies.
In addition to the ultra-low voiding, Indium10.1HF has a variety of characteristics that make it the best choice to address the challenges of the industry’s trend toward miniaturization, including:
- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
- Solder beading minimization
- Very low bridging, slump, and solder balling
- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
- High print transfer efficiency with low variation
For more information about Indium10.1HF Solder Paste or Indium Corporation’s complete Pb-free solder paste series, visit https://www.indium.com/solder-paste-and-powders/lead-free/ or email [email protected].
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer ToAnother®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
