Indium Corporation has earned the SMT China Vision Award for its Indium10.1HF Solder Paste on April 24 at NEPCON China.
SMT China Vision 奖旨在表彰在SMT方法、工艺、材料、设备、软件和管理服务方面拥有创新产品和技术的国内外公司。每项参选产品均根据其创造性、技术先进性以及对降低成本、改善质量、提高效率、增强可靠性、确保安全和保护环境的贡献进行评估。
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom terminated component (BTC) assemblies.
In addition to the ultra-low voiding, Indium10.1HF has a variety of characteristics that make it the best choice to address the challenges of the industry’s trend toward miniaturization, including:
- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
- Solder beading minimization
- Very low bridging, slump, and solder balling
- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
- High print transfer efficiency with low variation
For more information about Indium10.1HF Solder Paste or Indium Corporation’s complete Pb-free solder paste series, visit https://www.indium.com/solder-paste-and-powders/lead-free/ or email [email protected].
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
