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Indium Corporation Introduces Ultra-Thin Precision AuSn Preform

Indium Corporation has expanded its portfolio of precision preforms with an ultra-thin AuSn preform designed for semiconductor laser applications, where thermal management has become a challenge.

Indium Corporations AuLTRAThInFORMS are 0.00035 thick (0.00889mm or 8.89m) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as:

  • 短絡はんだ量が減少し、ダイ上へのウィッキングが抑制されるため、短絡のリスクが最小限に抑えられる。
  • Poor thermal transferthe ultra-thin 0.00035 preform reduces bond-line thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device.

For more information about Indium Corporations precision gold products, visit indiumstg.wpenginepowered.com/gold.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another(#FOETA), at www.facebook.com/indium or @IndiumCorp.