プリント基板（PCB）アセンブリ

Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin

If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due

SigFolks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s smallest electronics components, known as

This final post in a series on the stencil printing aspect of SMT optimization using ultrafine solder paste pulls together everything we have discussed previously as we look at the effect of solder

皆さん、前回の投稿で述べたように、PIP（ピン・イン・ペースト）工程でよくある問題ですが、適切なはんだを得るのに苦労します。

Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure

微細なペーストを印刷するためのソルダーペースト印刷を改善するための継続的な調査と探求において、我々はまた、一貫性（低標準偏差）は、以下の場合に正方形の開口部が有利であることを発見しました。

In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble vs. no-clean, also plays a significant role. Solder

(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “belt” is his solder paste inspection (SPI)