Tin whiskers are thinner than a human hair, but these electrically-conductive structures have been known to cause sudden failures and intermittent problems due to their ability to short closely spaced electronic circuits.
On Tuesday, Oct. 19, Indium Corporations Ron Lasky, Ph.D., PE, senior technologist, will host a webinar on these crystalline structures of tin at 10 a.m. San Francisco/1 p.m. New York/6 p.m. London/7 p.m. Germany as part of the companys free webinar program, the InSIDER Series.
First reported in the 1940s and 1950s, tin whiskers continue to be a major concern for the electronics assembly industry. Dr. Lasky will provide an explanation of tin whiskers and provide insight into their formation, as well as summarize their potential risks and mitigation techniques.
He will also provide a description of Failure Modes and Effects Analysis (FMEA) as a technique to assess tin whisker risk for a given technology, which will then be discussed. He will conclude this workshop with a discussion of tin whisker reliability strategies for consumer and mission critical products. At the end of the presentation, attendees will have all of the basic relevant information to develop an effective tin whisker strategy.
Dr. Laskys webinar is offered as part of Indium Corporations free webinar program, the InSIDER Series. You can register for his webinar at https://indium.news/3mA0ZJ7.
Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering and the director of the Lean Six Sigma program at Dartmouth College in Hanover, N.H., U.S. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering, and science and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of Surface Mount Technology Associations (SMTA) SMT Process Engineering Certification program and exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded SMTAs Founders Award in 2003.
インジウム・コーポレーションについて
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、Jingya HuangまでEメールにてお問い合わせください。また、当社の専門家であるFrom One Engineer To Another (#FOETA)を、www.linkedin.com/company/indium-corporation/または@IndiumCorp でフォローすることもできます。
