Indium Corporation will introduce NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC), May 31-June 3, San Diego, Calif., U.S. Engineered with high-tack characteristics, NC-809 is designed to hold die or solder spheres in place without risk of die shift during the assembly process.
NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporations proven ultra-low residue (ULR) fluxes such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
NC-809 offers:
- High tackiness to eliminate die tilting or shifting during reflow; greatly reducing electrical open failures
- Consistent flux deposition and excellent wetting
- Ultra-low residue; ideal for customers building tight-pitch flip-chip assemblies
- Compatibility with a wide variety of underfills
- Reduced warpage of package and lower thermal stress due to absence of cleaning step
To learn more about this product and Indium Corporations suite of proven ultra-low residue fluxes, visit www.indium.com/products/fluxes/semiconductor-fluxes/ or visit Indium Corporations booth at the show.
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、Jingya HuangまでEメールにてお問い合わせください。また、当社の専門家であるFrom One Engineer To Another (#FOETA)を、www.linkedin.com/company/indium-corporation/または@IndiumCorp でフォローすることもできます。
