Indium Corporation will introduce NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC), May 31-June 3, San Diego, Calif., U.S. Engineered with high-tack characteristics, NC-809 is designed to hold die or solder spheres in place without risk of die shift during the assembly process.
NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporations proven ultra-low residue (ULR) fluxes such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
NC-809 提供：
- High tackiness to eliminate die tilting or shifting during reflow; greatly reducing electrical open failures
- Consistent flux deposition and excellent wetting
- Ultra-low residue; ideal for customers building tight-pitch flip-chip assemblies
- 与多种填充物兼容
- 由于无需清洁步骤，减少了封装翘曲，降低了热应力
To learn more about this product and Indium Corporations suite of proven ultra-low residue fluxes, visit indiumstg.wpenginepowered.com/products/fluxes/semiconductor-fluxes/ or visit Indium Corporations booth at the show.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
