Indium Corporation’s Maria Durham will present at IMAPS’ Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging Sept. 22 at SUNY Polytechnic Institute in Utica, N.Y.
Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will present Meeting Solder Paste Printing Challenges for SiP in “Smart” IoT Devices. Her presentation will cover ultra-fine pitch solder paste printing to meet the needs of system-in-package (SiP) mobile devices, with a focus on attachment of 01005 and 008004 passive devices.
Additionally, Derrick Herron, Technical Support Engineer, will serve as chair for the Test/Reliability/Modeling session.
Durham serves as technical liaison between Indium Corporation’s customers and internal departments, such as sales, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor’s degree in physics and applied mathematics from Clarkson University, Potsdam, N.Y.
Herron provides technical service to customers in the northeastern United States. Previously, he spent more than six years developing solder paste and flux technologies in Indium Corporation’s research and development laboratory. Herron earned his bachelor’s degree in chemistry from Oklahoma State University, Stillwater, Okla. He received his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is certified in IPC-A-600 and IPC-A-610-D.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理、太陽電池市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
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