Indium Corporation’s Maria Durham will present at IMAPS’ Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging Sept. 22 at SUNY Polytechnic Institute in Utica, N.Y.
Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will present Meeting Solder Paste Printing Challenges for SiP in “Smart” IoT Devices. Her presentation will cover ultra-fine pitch solder paste printing to meet the needs of system-in-package (SiP) mobile devices, with a focus on attachment of 01005 and 008004 passive devices.
Additionally, Derrick Herron, Technical Support Engineer, will serve as chair for the Test/Reliability/Modeling session.
Durham serves as technical liaison between Indium Corporation’s customers and internal departments, such as sales, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor’s degree in physics and applied mathematics from Clarkson University, Potsdam, N.Y.
Herron provides technical service to customers in the northeastern United States. Previously, he spent more than six years developing solder paste and flux technologies in Indium Corporation’s research and development laboratory. Herron earned his bachelor’s degree in chemistry from Oklahoma State University, Stillwater, Okla. He received his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is certified in IPC-A-600 and IPC-A-610-D.
铟泰公司 面向全球电子、半导体、薄膜、热管理及太阳能市场的顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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