Indium Corporation will feature an array of its innovative thermal management solutions at SEMI-THERM, March 2528, in San Jose, CA.
Indium Corporation’s Heat-Spring solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to Indium Corporation’s reclaim and recycle program.
The GalliTHERM portfolio of gallium-based liquid metal solutions draws on Indium Corporation’s more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:
- 最終製品の寿命と信頼性を高める高熱伝導性
- ほとんどの表面に対して低い界面抵抗で、迅速な熱放散を確保
- Extraordinary wetting ability to both metallic and non-metallic surfaces
Based on the company’s proprietary manufacturing process, Indium Corporation will also be featuring solder thermal interface material (sTIM) for ball grid array (BGA) packages, specifically its indium-silver (InAg) alloys which offer lower voiding compared to pure indium for BGA packages that undergo multiple SAC reflows after the initial TIM-assembly.
To learn more about Indium Corporation’s thermal management solutions, visit our experts at SEMI-THERM.
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
