Indium Corporation will feature an array of its innovative thermal management solutions at SEMI-THERM, March 2528, in San Jose, CA.
Indium Corporation’s Heat-Spring solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to Indium Corporation’s reclaim and recycle program.
The GalliTHERM portfolio of gallium-based liquid metal solutions draws on Indium Corporation’s more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:
- High thermal conductivity for end-product longevity and reliability
- 与大多数表面的界面阻力小，确保快速散热
- 对金属和非金属表面均具有卓越的润湿
Based on the company’s proprietary manufacturing process, Indium Corporation will also be featuring solder thermal interface material (sTIM) for ball grid array (BGA) packages, specifically its indium-silver (InAg) alloys which offer lower voiding compared to pure indium for BGA packages that undergo multiple SAC reflows after the initial TIM-assembly.
To learn more about Indium Corporation’s thermal management solutions, visit our experts at SEMI-THERM.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
