Indium Corporation will feature its high-reliability solder paste and innovative alloy pairing, which provides enhanced performance in automotive applications, at SMTconnect, May 5-7, Nuremberg, Germany.
Indium8.9HF 錫膏是經業界驗證的錫膏，提供免清洗、無鹵素的解決方案，設計用於生產低揮發、增強電氣可靠性，以及改善高可靠性汽車電子產品印刷製程中的穩定性。
Indium8.9HF：
- 透過增強表面絕緣電阻 (SIR)，抑制電流洩漏和樹枝狀生長，提高電氣可靠性
- Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- 即使在鋼板上放置 60 小時，仍有極佳的暫停反應
- 在室溫下放置一個月後，印刷和回流焊性能增強
- 冷藏時可保持長達 12 個月的穩定列印效能
- 提供優異的引腳貼合與通孔焊接性
- 防止助焊劑過早擴散，防止表面氧化
- 適用於含 Pb 和不含 Pb 的合金。
Indalloy®292 is an innovative alloy engineered to provide advanced reliability for high-performance applications, offering excellent thermal cycling performance at -40/150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy provides pinhole elimination, which improves joint appearance. Indalloy®292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.
For more information about Indium Corporation's proven products for automotive applications, visit its booth at Hall 5, Booth 310 or visit indiumstg.wpenginepowered.com/products/solders/solder-paste/.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
