Indium Corporation will feature its high-reliability solder paste and innovative alloy pairing, which provides enhanced performance in automotive applications, at SMTconnect, May 5-7, Nuremberg, Germany.
Indium8.9HF 焊膏是一种经过行业验证的焊膏，可提供免清洗、无卤素的解决方案，旨在产生低空洞、提高电气可靠性，并改善高可靠性汽车电子产品印刷过程中的稳定性。
铟8.9HF：
- 增强的表面绝缘电阻 (SIR) 可抑制电流泄漏和树枝状生长，从而提高电气可靠性
- Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- 即使在网板上放置 60 个小时后，暂停响应也非常好
- 在室温下放置一个月后，印刷和回流焊性能得到增强
- 冷藏后可保持长达 12 个月的稳定印刷性能
- 具有极佳的引脚锡膏和通孔焊接性
- 防止助焊剂过早扩散，防止表面氧化
- 适用于铅合金和无铅合金。
Indalloy®292 is an innovative alloy engineered to provide advanced reliability for high-performance applications, offering excellent thermal cycling performance at -40/150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy provides pinhole elimination, which improves joint appearance. Indalloy®292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.
For more information about Indium Corporation's proven products for automotive applications, visit its booth at Hall 5, Booth 310 or visit www.indium.com/products/solders/solder-paste/.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
