在考慮浸錫元件之前，您最好先確認錫膏或助焊劑的：1）厚度適當；2）在助焊劑儲槽表面均勻。您可以使用薄膜深度計來檢查。從托盤中拿起一個封裝元件後，將其放在要浸入錫膏或助焊劑的中心位置。再次確認焊膏或助焊劑的表面是否平滑均勻。將元件浸入儲存槽中，讓它在儲存槽中見底。現在您可以從儲存槽中取出元件，並觀察元件焊球留下的印記。如果印記看起來扭曲或不完整，可能是材料深度或共平面有問題。如果圖案看起來清晰且規則，請繼續放置元件。請確保透過推進刀片 (線性托盤) 或旋轉儲存器 (旋轉托盤)，每次都將助焊劑儲存器調平。
In Part 2, we outlined materials challenges that can impact robotic soldering performance. In Part 3, we shift to product solutions and emerging innovations—highlighting how cored wire performance
In Part 1, we covered how robotic soldering evolved, and why materials quality is a major driver of process stability and precision. In Part 2, we focus on common materials-related issues that can
Robotic soldering has evolved from a productivity upgrade into a precision requirement—especially as electronics become smaller, denser, and require shorter production cycles. In Part 1 of this
