在討論過助焊剂清除（通常是欠填充的前奏）之後，很自然地就要討論毛細管欠填充。低凸點支撐會造成水溶性清洗的問題，同樣地，毛細管底層填充也很難在標準條件下使用。有些毛細管底層填料製造商可能會為最緊湊的應用提供替代材料，因此請仔細檢查您使用的是最佳材料。 儘管可能很想提高底層或噴嘴的熱度，但請堅持在底層填料指定的範圍內。您可以使用 CSAM 或 dye-n-pry 方法檢查未充填倒裝晶片的流動特性。填充流動性不佳會導致固化後焊錫凸點周圍出現氣泡。
In Part 1, we covered how robotic soldering evolved, and why materials quality is a major driver of process stability and precision. In Part 2, we focus on common materials-related issues that can
Robotic soldering has evolved from a productivity upgrade into a precision requirement—especially as electronics become smaller, denser, and require shorter production cycles. In Part 1 of this
Silver prices are escalating rapidly, consistently trending upward. If you manage a bill of materials (BOM) for electronics manufacturing, you understand precisely how this volatility impacts your
