Indium Corporation 的 Tech Seconds 視訊系列由Phil Zarrow在 60 秒內回答電子組裝業最常見的問題。在本期影片中，Phil 將介紹何時使用肩部輪廓。
問題：嘿，Phil，我很熟悉 ramp-to-spike 和 soak reflow profile。什麼是肩式回流剖面？
Phil Zarrow：肩部輪廓是由 Indium Corporation 的技術副總裁 Ning-Cheng Lee 博士所開發。我們這裡的基本上是一個直斜坡剖面，但我們增加了一個非常短的浸泡區。一般而言，浸泡時間大約在 30 秒以下，並且大約比焊料合金的液態溫度低 15-20 度。
問題為什麼要使用肩部輪廓？
Phil Zarrow：肩部輪廓可減少墓石，並提高潤濕效果。我們的想法是確保整個組件同時進入液相層，因此降低峰值時的 Delta T。
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