Indium Corporation’s Tech Seconds video series features Phil Zarrow answering the electronics assembly industry’s most commonly asked questions… in less than 60 seconds. In this installment, Phil describes when to use a shoulder profile.
问题嘿，菲尔，我熟悉斜坡到尖峰和浸泡回流曲线。什么是肩式回流曲线？
Phil Zarrow: The shoulder profile was developed by Dr. Ning-Cheng Lee, the Vice President of Technology at Indium Corporation. What we have here is essentially a straight ramp profile, but we've added a very short soak zone. Typically, somewhere in the vicinity of under 30 seconds, and approximately 15-20 degrees below the liquidus temperature of the solder alloy.
问题为什么要使用肩部轮廓？
菲尔-扎罗肩部轮廓可减少墓石，并提高润湿性。这样做的目的是确保整个组件同时进入液相，从而降低峰值时的 Delta T。
